1  Cover

      2  Title Page

      3  Copyright

      4  Preface

      5  1 General Aspects 1.1 Subjects of the Book 1.2 Special Issues 1.3 Injection Molding 1.4 Miniature Molding Processes 1.5 Computer Determination of Weld Lines in Injection Molding 1.6 Extrusion Blow Molding 1.7 Microcellular Injection Molding 1.8 Mold Cooling 1.9 Microcellular Foam Processing System 1.10 Molding Machine for Granules 1.11 Foam Curing of Footwear 1.12 Injection Compression Molding 1.13 Hot Press System 1.14 Stamper Mold 1.15 Plastic Waste References

      6  2 Process Analysis 2.1 Concepts and Strategies 2.2 Linear Systems 2.3 Twin-Screw Extrusion References

      7  3 Examples of Process Analysis 3.1 Greenhouse Gas Balance 3.2 Injection Molding Technology 3.3 Shrinkage in Injection Molding 3.4 Recycling by Extrusion 3.5 Batch Washing of Recycled Films 3.6 Self-Purging Microwave Pyrolysis 3.7 Purging and Plasticization in Injection Molding 3.8 Hot Runner Systems 3.9 Blown Film Extrusion and Thickness Control 3.10 Residence Time Distribution for Biomass Pyrolysis 3.11 Reactive Extrusion References

      8  4 Process Instrumentation 4.1 In-Mold Measurement 4.2 Temperature 4.3 Position Transducers 4.4 Composition of Matter 4.5 Medical Issues References

      9  5 Actuators and Final Control Elements 5.1 Servo Valves 5.2 Servo Motors 5.3 Solenoid Valves 5.4 Heaters 5.5 Drive Motors and Motor Speed Control for Extrusion References

      10  6 Analysis of Melt Processing Systems 6.1 Process Parameter Determination of Plastic Injection Molding 6.2 Process Parameter Determination of Plastic Injection Molding of LCDs 6.3 Processing History 6.4 Shear History 6.5 Extrusion Product Control 6.6 Extrusion Blow Molding Parison Control 6.7 Injection Molding 6.8 Thermoforming 6.9 Rotomolding 6.10 Compounders References

      11  7 Auxiliary Equipment 7.1 Crammer Feeder 7.2 Dryers 7.3 Pullers 7.4 Chillers 7.5 Robots References

      12  Index

      13  End User License Agreement

      1 Chapter 1Figure 1.1 Weldless-type injection mold apparatus (24).Figure 1.2 Heated states